Tergeo and Tergeo-plus - advanced features in a compact and economical system...
Some typical applications:
photoresist ashing, descum and silicon wafer cleaning
PDMS, microfluidics, glass slides and lab-on-a-chip
SEM/TEM specimen cleaning for hydrocarbon contamination removal*
medical device activation, sterilization and improved coating adhesion
wire bonding, flip-chip underfill, device encapsulation and decapsulation
improve bonding of metal-to-metal devices and composites
improve bonding of plastics, polymesr and composite materials
* For TEM specimen and specimen rod cleaning see: Tergeo-EM
Intelligent, intuitive design...
PIE Scientific's understanding of the importance of consistency and repeatability in scientific research and small scale production runs is emboddied in the design of the Tergeo and Tergeo-plus. At the heart of both instruments are integrated multiple process control technologies to monitor and control critical parameters. These include pressure and plasma sensing (see below) and automatic mass flow control of gas input. Operation is fully automatic, with an intuitive user interface featuring a 7" touchscreen which make the operation as easy as a tablet device, with the embedded microcontroller supporting 20 customisable user recipes. The Tergeo series delivers day-in, day-out reliability and repeatable performance.
Unique, quantitative plasma sensor technology
A key advantage of the Tergeo series is integrated, patent-pending plasma sensor technology. The plasma strength is measured quantitatively and displayed in real time on the LCD touch screen controller. The operator can use the plasma strength data as feedback to adjust gas flow rates and RF power to give desired cleaning speeds – ensuring repeatable and consistent results for users with beginner or expert levels of experience.
Downstream cleaning recipe example Immersion cleaning recipe example
Immersion with downstream plasma processing option
Immersion mode - high-speed etching
Tergeo and Tergeo Plus have the capablity of two integrated RF plasma sources in one instrument- an in-situ source plus the option of remote source (PIE013). When the plasma is generated inside the main specimen chamber, it is called immersion mode processing and specimens are subject to both energetic ion bombardment and chemical reactions with neutral radical species. Immersion mode processing is required for high-speed etching, surface modification.
Downstream mode - for delicate specimens
For specimens such as thin gate oxides, ESD sensitive devices, anti-reflective coatings, graphene, carbon nanotubes, DLC (diamond-like-carbon) and holey carbon support films for TEM, immersion mode processing may cause irreversible damage. In these cases downstream processing mode is recommended. In this mode, the plasma is generated inside a remote plasma source attached to the side of the main specimen chamber. In downstream mode only neutral lower energy radical species generated inside the remote plasma source can diffuse into the specimen and react with specimens - ensuring there is no ion sputtering damage to delicate specimens.
Pulsed operation - for gentler, damage-free processing
The plasma is ignited at a high pressure and at a low average power
Research has shown that RF plasma reaction rates can be maintained in pulsed operation, despite a lower more "specimen friendly" average power. Using pulsed operation (the Tergeo series uses 480Hz) can reduce "dust" particle formation, trenching, notching and charging. For fluorocarbon PECVD process, pulsed operation can yield rougher surface structure and thereby give greater hydrophobicity.
Tergeo and Tergeo Plus require a primary vacuum pump. The Edwards nXDS6i scroll pump is suitable for when oil-baed pumps need to be avoided (i.e. dry pumping). We also offer a standard oil-based rotary pump and a Fomblinised version for applications where high throughputs of oxygen are required. Please see Ordering Information (below) for details of pumps and accessories.
Job sequence mode operation for three cleaning steps
Two mass flow controllers (MFC) regulated gas inputs
Premium pressure sensor from MKS Instruments (1E-4Torr to atm)
Venting/purging port with electronic solenoid valve (Swagelock 1/4" compression fitting)
One pumping port with electronic shut-off valve and standard NW/KF25 vacuum port
Note: vacuum pump required (see Pumping Options)
Edwards nXDS6i dry scroll vacuum pump. Peak pumping speed: 6.2 m3h-1 . Suitable for applications where oil-based rotary pumps need to be avoided.
Pumping speed: 3.3 m3h-1 (50hz). The RV3 oil-sealed rotary vane pumps delivers excellent ultimate vacuum pressure, high pumping speeds and superior vapour handling capabilities with quiet operation. Requires an EMF10 mist filter (A4622600)
The Edwards EMF10 filter captures oil mist from the outlet of pumps, which would otherwise be ejected into the atmosphere. The EMF10 mist filter is suitable for use with Edward RV3, RV5 and RV8 vacuum pumps. They are very efficient at 99.999% DOP test and are also azide proof. Supplied with a NW25 clamp, centering ring and ‘O’ ring, NW25 to 3/4 inch BSP adaptor.
Pumping speed: 3.3 m3h-1 (50hz)
Edwards RV3 especially adapted for use with Fomblin oil for applications where oxygen is used as a process gas. Requires an EMF10 mist filter (A4622600) and Fomblin oil (H11301019)
For use with the Edwards RV3FX Fomblinised rotary vacuum pump
Tergeo-EM optional accessories
Upgrade from standard 75W to 150W RF power supply
Integrated, remote RF plasma source for downstream cleaning