Epoxy resin vacuum sealant
Hysol 1C / Torr Seal Vacuum Epoxy Resin Sealant kit
Hysol 1C high vacuum epoxy glue and sealant is ideal for sealing leaks on vacuum systems, bonding vacuum components, repair of vacuum components and to seal electrical feedthroughs on high vacuum systems. Hysol 1C epoxy sealant is fully equivalent to Torr Seal sealant.
It is a two- component epoxy resin system with no solvents. Due to the low outgassing rates of the cured epoxy, it can be used in high vacuum systems at 10-9 mbar or below. The service temperature range for Hysol 1C is -45°C to +120 °C, which is just above the baking temperature for high vacuum systems. Hysol 1C epoxy resin provides excellent bonding on metals, ceramics, glass and most plastics. It is easy to use: mix two equal lengths of resin and hardener. Bonding can be improved by making the bonding surfaces rougher. The pot-life of Hysol 1C is approximately 20 minutes after mixing the two components. It cures at room temperature and reaches full curing after 72 hours at room temperature. Elevated temperatures between 60 -100 °C greatly reduce curing time. Cured Hysol 1C can be machined, sanded and polished.
Typical applications include:
- Vacuum feedthrough sealant
- Electrical insulation of feedthrough contacts
- High vacuum leak sealant
- Epoxy embedding of EM samples
- Bonding of vacuum components
- Repair of vacuum components or damaged parts
Safety data sheet: SDS 64-002002
Specifications
| Product # | 64-002002 |
| Service temperature range | -45°C to +120°C |
| Mix ratio by weight | 100/44 – resin/hardener |
| Mix ration by volume | 2.5/1 – resin/hardener |
| Colour | Resin – white, hardener – beige |
| Viscosty, cP resin | 140,000 – 330,000 |
| Viscosity, cP hardener | 550,000 – 870,000 |
| Viscosity, cP mixed | 200,000 – 500,000 |
| Pot-life @ 25°C | ≥ 20 minutes |
| Cure at room temperature | Up to 72 hrs |
| Cure at 60-100°C | Several hours |
| Density @ 25°C | 1.65 g/cm3 |
| Glass transition temperature Tg | 98°C |
| Shore hardness, durometer D | ≥80 |
| Thermal expansion pre/post Tg | 39 x 10-6 / 135 x 10-6 |
| Thermal conductivity | 0.77 W/(m.K) |
| Dielectric breakdown strength | 23.1 kV/mm |
